| PART |
Description |
Maker |
| B72500TXXXX B72500VXXXX B72530VXXXX B72540VXXXX B7 |
(B725xxTxxxx) Multilayer technology
(B725xxVxxxx) Multilayer technology
|
EPCOS
|
| CT1210KXXG |
Multilayer technology
|
EPCOS
|
| MLVS-0603 |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology 本规范适用于金属氧化物压敏电阻片的多层技
|
Electronic Theatre Controls, Inc.
|
| PIC18F4580-I_ML PIC18F4580-I_P PIC18F4580-I_PT PIC |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| PIC18F248009 PIC18F4480-E_ML PIC18LF4480-E_ML PIC1 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| UP025SL120J-B-BZ UP025SL150J-B-BZ UP025SL010D-B-BZ |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000015 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.000001 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, SL, 0.00001 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0047 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.018 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0027 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0039 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0022 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0015 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0018 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0056 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.022 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0012 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0033 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.01 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, B, 0.0068 uF, THROUGH HOLE MOUNT AXIAL LEADED, ROHS COMPLIANT
|
Taiyo Yuden Co., Ltd.
|
| SIGC81T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| LCBX7RHT333K LCCZ5UHT333Z LCCX7RHT333J LCAZ5UHT333 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.033 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Z5U, 0.033 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.033 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0047 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0015 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0022 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0012 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0039 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0082 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.01 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0056 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00082 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0018 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.1 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.001 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0027 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 200 V, C0G, 0.000022 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0033 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0068 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.012 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT
|
KOA Speer Electronics,Inc.
|
| 0907X7R104Z2FB 0907X7R104Z2F4 0907X7R104Z2F5 0907X |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.1 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.00082 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0082 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.082 uF, SURFACE MOUNT, 3439 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.06 uF, SURFACE MOUNT, 2725 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.68 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.068 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.68 uF, SURFACE MOUNT, 2321 CHIP
|
Presidio Components, Inc.
|
| SIGC144T170R2C SIGC144T170R2C09 |
IGBT Chip in NPT-technology 1700V NPT technology 280 μm chip
|
Infineon Technologies AG
|
| IGB15N60T |
Low Loss IGBT in Trench and Fieldstop technology 在戴低损失和场终止IGBT技
1200V IGBT for frequencies up to 10kHz for hard switching applications and up to 30kHz for soft switching. Combined Trench- and Fieldstop-Technology. ...
|
INFINEON[Infineon Technologies AG]
|
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